Intel introduces its first Gigabit LTE modem XMM 7560, 3rd Gen Platform for testing 5G devices
Highlights of Intel XMM 7560
Supports 3GPP Rel-13
MIMO support – downlink: 2×2, 4×2, 8×2, 4×4, 8×4
LAA – LTE/Wi-Fi link aggregation
Network Assisted Interference Cancellation and Suppression (NAICS) support
Carrier aggregation support across TDD and FDD spectrum
Supports downlink aggregation of four non-contiguous bands up to 100 MHz
Multi-SIM support including LTE/LTE combinations
Six-mode operation, including LTE-FDD, LTE-TDD, TD-SCDMA, GSM/EDGE, UMTS/WCDMA and CDMA/EVDO for markets worldwide
Intel SMARTi 7 transceiver-based scalable RF solution with support for up to 35 LTE bands for global coverage and roaming
All major carrier aggregation combinations fully supported
Flexible RF architecture to customize devices to operators’ unique geographic requirements
Intel 3rd gen mobile trial platform
Intel also announced 3rd Generation Intel Mobile Trial Platform that offers a high-performance development platform for faster integration and testing of 5G devices and wireless access points. Intel said that it is currently working with global operators on 5G development, prototyping and testing with this new trial platform, with further evolution of the platform to come.
The 3rd Generation programmable Intel Mobile Trial Platform will double the horsepower of the 2nd Gen Intel Mobile Trial Platform by upgrading from Intel Arria 10 FPGAs to Intel Stratix 10 FPGAs. It will also incorporate fundamental NR air interface physical layer features, such as low latency sub-frame design; flexible and scalable numerology multiplexing; 5G LDPC and Polar channel coding; massive MIMO, and beamforming.
The Intel XMM 7560 modem is expected to sample in H1 2017 and will enter into production soon afterward. The 3rd Generation Intel Mobile Trial Platform will be operational in H2 2017.